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DC RESISTIVITY AND DIELECTRIC STUDIES ON Ti4+ SUBSTITUTED Ni-Zn FERRITES

B. Parvatheeswara Rao1, K. H. Rao1, T. Vasantha Rao1, A. Paduraru2, O. F. Caltun2,*

Affiliation

  1. Department of Physics, Andhra University, Visakhapatnam 530003, India
  2. Department of Electricity and Electronics, A. I. Cuza University, Iasi, Romania

Abstract

Ni0.65 Zn0.35+x Fe1.99-2x In0.01 Tix O4 with x values ranging from 0.000 to 0.125 in steps of 0.025 have been prepared by conventional ceramic technique. Studies were made to estimate the influence of the concentration of the Ti substitution on the dc resistivity and dielectric constant of these ferrites. The resistivity has been found to increase by increasing concentration of titanium ions. Resistivity versus temperature measurements were carried out in order to deduce the activation energies in both ferrimagnetic and paramagnetic regions. Temperature variation of resistivity was marked by an exponential fall with rising temperature up to Curie temperature. Increasing up the temperature further changes conduction mechanism and the resistivity increases. Activation energies corresponding to the slopes for both regions of each sample have been estimated. These values indicate that the titanium substitution blocks the dominant conduction mechanism. The dielectric constant has been found to exhibit a trend different from that of dc resistivity. The Ti ions induce lower dielectric constants in the doped systems. Dielectric dispersion exhibits normal behavior up to 2 MHz. The results are explained taking into account the conduction and polarization processes associated with the ions having different valence states and being distributed in different lattice sites..

Keywords

NiZn ferrite, Ti substitution, Electrical properties.

Submitted at: June 10, 2004
Accepted at: March 23, 2005

Citation

B. Parvatheeswara Rao, K. H. Rao, T. Vasantha Rao, A. Paduraru, O. F. Caltun, DC RESISTIVITY AND DIELECTRIC STUDIES ON Ti4+ SUBSTITUTED Ni-Zn FERRITES, Journal of Optoelectronics and Advanced Materials Vol. 7, Iss. 2, pp. 701-704 (2005)