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THE INFLUENCE OF Cu ON THE MORPHOLOGICAL AND CHEMICAL PROPERTIES OF NANOSTRUCTURED TiO2 FILMS

M. Gartner1, A. Ghita1, M. Anastasescu1,* , P. Osiceanu1, G. Dobrescu1, M. Zaharescu1, D. Macovei2, M. Modreanu3, C. Trapalis4, G. Kordas5

Affiliation

  1. Institute of Physical Chemistry ”I.G.Murgulescu” of the Romanian Academy, 202 Splaiul Independentei, 060021, Bucharest, Romania
  2. National Institute of Materials Physics, P.O. Box MG7, Magurele, Bucharest, Romania
  3. NMRC, University College, Lee Maltings, Prospect Row Cork, Ireland
  4. Institute of Materials Science, National Centre for Scientific Research “Demokritos”, 153 10, Athens, Greece
  5. Institute of Materials Science, National Centre for Scientific Research “Demokritos”, 153 10, Athens, Greece

Abstract

TiO2 multilayer films were deposited by the sol-gel method on glass and SiO2/glass substrates. 10% of Cu was added to the coating solution, to study its effect on the amorphous to anatase phase transition, with a view to improving the photocatalytic activity. Densification of the films was obtained by thermal treatment at 500 oC for 1 hour in oxidative and reductive conditions. In order to check the correlation between the influence of copper, substrate and annealing temperatures on the structural, morphological and optical properties, the samples were characterized by FTIR, XPS, SEM and fractal analysis. Transformation of CuO from as-prepared samples into Cu2O and metallic Cu, depending on the treatment conditions, was shown. The composition and stoichiometry of the oxide films in the first atomic layers were quantitatively determined as chemical state relative concentrations..

Keywords

Thin films, Nanoparticles, Sol-gel method, TiO2-CuO.

Submitted at: Dec. 9, 2004
Accepted at: Jan. 26, 2005

Citation

M. Gartner, A. Ghita, M. Anastasescu, P. Osiceanu, G. Dobrescu, M. Zaharescu, D. Macovei, M. Modreanu, C. Trapalis, G. Kordas, THE INFLUENCE OF Cu ON THE MORPHOLOGICAL AND CHEMICAL PROPERTIES OF NANOSTRUCTURED TiO2 FILMS, Journal of Optoelectronics and Advanced Materials Vol. 7, Iss. 1, pp. 401-405 (2005)