Cookies ussage consent
Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.I agree, do not show this message again.
M. PANTAZICĂ1, I. M. COSTEA2, C. I. MARGHESCU1, H. WOHLRABE3
- Assistant Professor, Department of Electronic Technology and Reliability, Politehnica University of Bucharest, Romania
- Lecturer, Departament Telematics and Electronics for Transport, Politehnica University of Bucharest, Romania
- Assoc. Prof., Centre of Microtechnical Manufacturing, Dresden University of Technology, Dresden, Germany
This paper presents part of the results obtained after conducting an experiment designed with the help of the Design of Experiments (DoE) method. The aim of this experiment is to evaluate the dependencies between the layout design and the production quality of surface mount (SMT) boards. The DoE method was used to plan the variation of certain factors in order to see their influences on the responses. In this paper, we will focus on the interpretation of the results obtained after measuring the distance between the board surface and the bottom side of a chip component 0805..
Chip 0805, Design of experiments, Stand-off.
Submitted at: Nov. 6, 2015
Accepted at: June 9, 2016
M. PANTAZICĂ, I. M. COSTEA, C. I. MARGHESCU, H. WOHLRABE, A study examining the influence of various design and process parameters on the solder joint thickness of 0805 components, Journal of Optoelectronics and Advanced Materials Vol. 18, Iss. 5-6, pp. 557-561 (2016)
- Download Fulltext
- Downloads: 79 (from 56 distinct Internet Addresses ).