"

Cookies ussage consent

Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.

I agree, do not show this message again.

Characterizing subsurface damage in loose abrasive grinding of fused silica glass

WEI YANG1, YAGUO LI2,3,* , JINGHUA HAN4, YINBIAO GUO1, JIAN WANG2, QIAO XU2

Affiliation

  1. School of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, China
  2. Fine Optical Engineering Research Center, Chengdu 610041, China
  3. Department of Machine Intelligence & Systems Engineering, Akita Prefectural University, Yurihonjo 015-0055, Japan
  4. School of Electronics & Information, Sichuan University, Chengdu 610065, China

Abstract

We assessed the subsurface damage (SSD) of loose-abrasive-ground fused silica with a recently proposed method. The method is capable of concurrently acquiring the depth of surface damage and morphologies at varied depths. The experimental results show that the depth of SSD is predominantly determined by the size of silicon carbide abrasives while machining parameters have little effects on the SSD depth under experimented conditions. To explain the interesting phenomenon, we proposed an interpretation that the depth of SSD is presumably controlled by fracture load of abrasives (i.e. the minimum load needed to crack abrasives) rather than applied downward load. Moreover, we found that relative velocity between glass workpiece and lapping plate in typical lapping has insignificant influence on the depth of SSD. The SSD depth scales well with abrasive size down to W7 SiC grits (~7microns of median size) in our experiments, which is different from previous research in which it was reported that the SSD asymptotically increased when the 7-micron abrasives was utilized..

Keywords

Subsurface damage, Loose abrasive grinding, Fuse silica, Abrasive size.

Submitted at: Nov. 22, 2011
Accepted at: Feb. 20, 2012

Citation

WEI YANG, YAGUO LI, JINGHUA HAN, YINBIAO GUO, JIAN WANG, QIAO XU, Characterizing subsurface damage in loose abrasive grinding of fused silica glass, Journal of Optoelectronics and Advanced Materials Vol. 14, Iss. 1-2, pp. 72-76 (2012)