"

Cookies ussage consent

Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.

I agree, do not show this message again.

High entropy alloys

I. FLOREA1, R. M. FLOREA1, O. BǍLŢǍTESCU1, V. SOARE2, R. CHELARIU1, I. CARCEAa*1,*

Affiliation

  1. ”Gheorghe Asachi” Technical University of Iasi, Prof Dr. D-tru Mangeron Street, Iasi, Romania, Postal code: 700050
  2. National Research & Development Institute for nonferrous and Rare Metals – IMNR 102 Biruinţei B-lvd, Pantelimon, Postal code: 077145, Ilfov, Romania

Abstract

In this paper we will present an overview of high entropy alloys and also will expose the research to date on these alloys. It should be mentioned that High Entropy Alloys are characterized as alloys consisting of roughly equal concentrations of at least five metallic elements and are claimed to favor close-packed, disordered structures due to high configurational entropy. Such crystal structures, e.g. face-centered cubic (FCC), are advantageous in that they should offer multiple active slip systems usually observed in ductile metals and alloys. This opens the door to a large number of rich chemistries which would otherwise contain unacceptable volume fractions of intermetallic compounds to be useful in structural applications.This paper is divided into several chapters which will present some general properties of alloys, application domains, and also a number of conclusions. In short we try to give some answers to frequently asked questions about this new area..

Keywords

High entropy alloys, Properties of alloys, Application domains.

Submitted at: March 25, 2013
Accepted at: July 11, 2013

Citation

I. FLOREA, R. M. FLOREA, O. BǍLŢǍTESCU, V. SOARE, R. CHELARIU, I. CARCEAa*, High entropy alloys, Journal of Optoelectronics and Advanced Materials Vol. 15, Iss. 7-8, pp. 761-767 (2013)