Cookies ussage consent
Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.
I agree, do not show this message again.Mathematical relation ships between alloying elements and technological deformability indexes
C. O. RUSĂNESCU1, M. RUSĂNESCU2,* , T. IORDĂNESCU3, F. V. ANGHELINA4
Affiliation
- University Polytechnic, Faculty of Biotechnical Systems Engineering Bucharest, Romania
- Valplast Industries Bucharest, Romania
- Metallurgical Research Institute Bucharest, Romania
- Faculty of Materials and Mechanical Engineering,18-24 Unirii Bld., 130082, Valahia University of Targoviste, Romania
Abstract
The aim of the paper is to assess mathematical relationship between alloying elements and technological deformability indexes. The subject proposed is settled through a laboratory experiment, where plasticity is appraised by pressing tests.Three steel grades are used. (OLT 35 K, 16 Mo 3, 14 CrMo 4) in order to determine their grain growth trend and their initial grain size at austenitization temperature. Structural analysis examined surfaces was performed for each steel grade for the following purposes: to determine the trend of increasing grain; determining initial grain austenitization temperature used in attempts (Ta = 12000C) determine the deformation temperature austenitic grain..
Keywords
The deformation resistance, Mathematical regressions, Microstructural analyze.
Submitted at: March 25, 2013
Accepted at: July 11, 2013
Citation
C. O. RUSĂNESCU, M. RUSĂNESCU, T. IORDĂNESCU, F. V. ANGHELINA, Mathematical relation ships between alloying elements and technological deformability indexes, Journal of Optoelectronics and Advanced Materials Vol. 15, Iss. 7-8, pp. 718-723 (2013)
- Download Fulltext
- Downloads: 356 (from 216 distinct Internet Addresses ).