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Ni-Cu-Co biaxially textured substrates for YBCO tape fabrication

GY. THALMAIER1,* , I. VIDA-SIMITI1, A. RUFOLONI2, G. CELENTANO2, A. VANNOZZI2, A. ANGRISANI2, T. PETRISOR1

Affiliation

  1. Technical University of Cluj-Napoca, C-tin Daicoviciu 15, Cluj –Napoca. Romania
  2. ENEA, Centro Ricerche Frascati, Via E. Fermi 45, 00044 Frascati, Rome, Italy

Abstract

One of the most promising techniques for high JC YBa2Cu3O7-x (YBCO) tape fabrication is the deposition of superconducting thick film on a biaxially oriented metallic substrate. Until now, Ni has been the most used substrate. The ferromagnetic behavior and the low strength after recrystallization represent the main drawback of the Ni substrates. This paper presents the magnetic and structural properties of a new metallic substrate based on Ni50Cu50 solid solution. The role of copper is to decrease the Curie temperature of Ni and, as a consequence, to reduce the ac losses in the substrate. The Curie temperature linearly decreases with copper concentration, reaching the zero value for about 65 at % Cu. In order to increase the strength, the Ni50Cu50 was alloyed with 3at. %Co. The (100)[001] cube texture was induced in (Ni50Cu50)97Co3 solid solution by cold rolling processing followed by a recrystallization thermal treatment at 900 °C for 4 hours in high vacuum (10-7 Torr). The as obtained tapes exhibit a sharp, well developed cube texture with the FWHM of ω-scans of 6°, respectively. The scanning electron microscope (SEM) analyses have revealed that the tapes exhibit a good morphology appropriate for the epitaxial deposition of buffer layer and of the YBCO film..

Keywords

Biaxially textured Ni-Cu-Co YBCO tape, SEM.

Submitted at: Feb. 25, 2008
Accepted at: April 4, 2008

Citation

GY. THALMAIER, I. VIDA-SIMITI, A. RUFOLONI, G. CELENTANO, A. VANNOZZI, A. ANGRISANI, T. PETRISOR, Ni-Cu-Co biaxially textured substrates for YBCO tape fabrication, Journal of Optoelectronics and Advanced Materials Vol. 10, Iss. 4, pp. 913-915 (2008)