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Separation of extremely miniaturized medical sensors by IR laser dicing

M. BIRKHOLZ1,* , K.-E. EHWALD1, M. KAYNAK1, T. SEMPEROWITSCH2, B. HOLZ2, S. NORDHOFF3

Affiliation

  1. IHP, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany
  2. Accretech GmbH, Landsberger Str. 396, 81241 München, Germany
  3. NXP Semiconductors, Stresemannallee 101, 22529 Hamburg, Germany

Abstract

A microchip separation process operating by pulsed-wave IR laser irradiation was applied to microviscosimeters that are intended to operate as glucose sensors for continuous monitoring of blood sugar levels in diabetics. After its technological preparation the sensor should no more dry up, since the retreating water would stick a movable cantilever to the ground plate and thereby plastically deform the sensor’s micromechanics. The cooling-free IR laser dicing process was thus chosen for the separation. It is shown that virtually particle free dices with lateral dimension down to some 100 µm could be prepared. The process is concluded to enable the dry, fast and clean separation of MEMS devices..

Keywords

MEMS, glucose sensor, Si wafer, stealth dicing.

Submitted at: June 16, 2009
Accepted at: Feb. 27, 2010

Citation

M. BIRKHOLZ, K.-E. EHWALD, M. KAYNAK, T. SEMPEROWITSCH, B. HOLZ, S. NORDHOFF, Separation of extremely miniaturized medical sensors by IR laser dicing, Journal of Optoelectronics and Advanced Materials Vol. 12, Iss. 3, pp. 479-483 (2010)