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Stress and texture in titanium nitride thin films by X-ray diffraction techniques

C. DUCU1,* , S. MOGA1, D. NEGREA1, V. MALINOVSCHI1, M. BALACEANU2

Affiliation

  1. University of Pitesti – Research Center for Advanced Materials, Pitesti, Romania
  2. National Institute for Optoelectronics – INOE 2000, Bucharest, Romania

Abstract

In this paper we used X-Ray diffraction techniques in order to study the microstructural parameters of TiN thin films deposited on silicon substrate by cathodic arc method. In terms of preferred orientation, the texture for all TiN thin films can be described as <111> || normal direction fiber texture. The residual stresses were evaluated using the crystallite group method, applicable for specimens exhibiting a crystallographic fiber texture being simultaneously strong and sharp..

Keywords

X-ray diffraction, Thin films, Texture, Residual stress.

Submitted at: Aug. 20, 2009
Accepted at: May 26, 2010

Citation

C. DUCU, S. MOGA, D. NEGREA, V. MALINOVSCHI, M. BALACEANU, Stress and texture in titanium nitride thin films by X-ray diffraction techniques, Journal of Optoelectronics and Advanced Materials Vol. 12, Iss. 5, pp. 1078-1082 (2010)