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Structural study of micro-crystalline silicon thin films deposited on flexible substrates with different thicknesses

XIAOJING WANG1,2,* , WENCONG LIU1,2

Affiliation

  1. School of electronic and electrical engineering, Wuhan Textile University, Wuhan 430074, China
  2. Hubei Engineering and Technology Research Center for Functional Fiber Fabrication and Testing, Wuhan Textile University, Wuhan 430074, China

Abstract

Microcrystalline silicon(μc-Si) thin films were deposited on the AZO/TPT flexible substrates by RF-PECVD. Effects of film thickness on the structure of thin films were investigated by XRD, SEM and Raman.The results indicated that uniform dense microcrystalline silicon thin films can be prepared by RF-PECVD. As thickness increases, the silicon thin film transitions from amorphous structure to microcrystalline structure. When the thickness reaches 493nm, the film begins to crystallize. However, the surface morphology deteriorates when the thickness reaches 882nm, which is reflects by poor surface smoothness and significant differences in grain size. XRD spectrum occurred (111), (220) and (331) peak, grain size and crystalline volume fraction increased along with film thickness increased, arrived at 82%..

Keywords

RF-PECVD, Flexible substrate, μc-Si, Structure.

Submitted at: Aug. 1, 2025
Accepted at: June 2, 2026

Citation

XIAOJING WANG, WENCONG LIU, Structural study of micro-crystalline silicon thin films deposited on flexible substrates with different thicknesses, Journal of Optoelectronics and Advanced Materials Vol. 28, Iss. 5-6, pp. 277-282 (2026)