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Study of a monocrystalline Cu-Al-Ni shape memory alloy by infrared thermography

C. BUBULINCĂ1,2, X. BALANDRAUD1, D. DELPUEYO1, M. GREDIAC1, S. STANCIU3, M. ABRUDEANU2,* , A.-G. PLAIASU2,* , M. M. DICU2, E. L. NITU2

Affiliation

  1. Clermont University, Blaise Pascal University, IFMA, Institut Pascal UMR CNRS 6602, BP 10448, 63000 ClermontFerrand, France
  2. University of Pitesti, Targu din Vale, No 1, 110040, Pitesti, Romania
  3. Tehnical University Gh. Asachi of Iasi, Bd. D. Mangeron 61A, 700050 Iasi, Romania

Abstract

In this article we study a monocrystalline Cu-Al-Ni shape memory alloy subjected to a small periodic tensile loading at ambient temperature. An infrared camera is used to capture the temperature fields at the specimen surface. As a result of the small loading oscillation, very localized thermal activities are observed. The heterogeneity of the temperature oscillation at the specimen surface is studied. Austenite-martensite interfaces are revealed by the thermal field processing..

Keywords

Shape memory alloy, Thermomechanical analysis, Infrared thermography.

Submitted at: Nov. 23, 2012
Accepted at: June 12, 2013

Citation

C. BUBULINCĂ, X. BALANDRAUD, D. DELPUEYO, M. GREDIAC, S. STANCIU, M. ABRUDEANU, A.-G. PLAIASU, M. M. DICU, E. L. NITU, Study of a monocrystalline Cu-Al-Ni shape memory alloy by infrared thermography, Journal of Optoelectronics and Advanced Materials Vol. 15, Iss. 5-6, pp. 544-549 (2013)